Toshiba is the pioneer of flash memory. Toshiba developed its first flash memory in 1980s and successfully marketed it in 1984. Ever since then flash memory has become a very popular medium to store data. With the passage of time and research the developers have been successful in reducing the size of flash memory chips. Recently Toshiba has introduced its 3rd generation 3d flash memory (BiCS FLASH). BiCS FLASH is a 3D flash memory which is capable of storing 65% greater capacity as compared to the 2nd generation flash memory. The previously used 2nd generation chips used 48 stack layers whereas the 3rd generation flash memory has 64 stack layers.
This new technology will allow to develop 1 TB chip which can be used for enterprise and consumer Solid State Drives. According to Scott Nelson, senior vice president of TAEC’s memory business unit, “The introduction of our third generation BiCS FLASH coupled with the industry’s largest 1TB chip solution strongly reinforces Toshiba’s flash leadership position. These innovations underline our commitment to developing leading-edge memory solutions, and we will continue to advance our 3D technology to meet the ever-increasing storage market demand.”
As we all know that flash memory has become an essential part of many devices used regularly in our daily life. Smartphones, SSD’s, USB Drives and Gaming Consoles are some of the commonly used devices having a flash memory. With this BiCS FLASH memory we will soon see an increase in storage capacities due to smaller size of the flash memory and reduction in the price. BiCS FLASH will also result in smaller and leaner devices. Toshiba has already sent the samples to the manufacturers and mass production of 3D memory chips has already started but the mass production will start in mid of 2017. Consumers will soon be able to use devices with larger storage capacity.